GaAs on 200 mm Si wafers via thin temperature graded Ge buffers by molecular beam epitaxy

For heterogeneous integration of III-V compound materials on 200 mm Si wafers, we present a complete in-situ molecular beam epitaxy (MBE) process from a Ge strain compensating buffer on Si to GaAs heteroepitaxy. The whole growth process, including high-k gate oxide deposition, is performed in a 200...

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Published in:Journal of crystal growth Vol. 323; no. 1; pp. 387 - 392
Main Authors: RICHTER, M, ROSSEL, C, FOMPEYRINE, J, WEBB, D. J, TOPURIA, T, GERL, C, SOUSA, M, MARCHIORI, C, CAIMI, D, SIEGWART, H, RICE, P. M
Format: Conference Proceeding Journal Article
Language:English
Published: Amsterdam Elsevier 15-05-2011
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Summary:For heterogeneous integration of III-V compound materials on 200 mm Si wafers, we present a complete in-situ molecular beam epitaxy (MBE) process from a Ge strain compensating buffer on Si to GaAs heteroepitaxy. The whole growth process, including high-k gate oxide deposition, is performed in a 200 mm MBE cluster tool. Thin (=0.3 [micro]m), temperature-graded Ge buffers are investigated and the influence of the substrate temperature during Ge nucleation and anneals is studied. Using such a buffer, GaAs was grown on 200 mm Si wafers and characterized structurally and electrically using MOS capacitors.
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ISSN:0022-0248
1873-5002
DOI:10.1016/j.jcrysgro.2010.12.002