Assembly Device for Supermodules of Silicon Tracking System of the BM@N Experiment

• Published in: Physics of particles and nuclei letters Vol. 20; no. 4; pp. 619 - 628
• Main Authors: Elsha, V. V., Korolev, M. G., Dementev, D. V., Igolkin, S. N., Sukhov, N. V., Sheremetev, A. D., Shitenkow, M. O., Voronin, A. L., Murin, Yu. A.
• Format: Journal Article
• Language: English
• Published: Moscow Pleiades Publishing 01-08-2023; Springer Nature B.V
• Subjects: Aluminum; Assembly; Cables; Carbon; Carbon fibers; Charged particles; Containers; Electronics; Heat sinks; Modules; Particle and Nuclear Physics; Physics; Physics and Astronomy; Physics of Elementary Particles and Atomic Nuclei. Experiment; Sensors; Silicon; Spatial resolution; Tracking systems; Trusses
• ISSN: 1547-4771; 1531-8567
• DOI: 10.1134/S1547477123040246

The silicon tracking system of the BM@N experiment consists of four stations based on double-sided microstrip silicon sensors. The sensors make it possible to obtain a spatial resolution for tracks of secondary charged particles up to 17 μm. Two ASIC boards, the input channels of which are connected to the strips with ultralight (0.23% X
0
) aluminum flex cables, are used to readout and process signals from both sides of the sensor. Such an assembly is called a module. Silicon sensors are mounted on lightweight carbon-fiber support trusses in a way that the dead zones at the edges are overlapped due to the tiled layout. The frontend electronics are housed in metal containers with a heat sink system located at the rare ends of the carbon-fiber support truss. A set of modules attached to the carbon-fiber support truss with two containers with readout electronics at the ends is called a supermodule. The accuracy of the sensor positioning in the station plane plays a crucial role in limiting the degrees of freedom of the parameters determined by the software during the final alignment of the tracking system elements. A special device that allows mounting sensors on a carbon fiber truss with an accuracy of up to 15 µm on a 1200 mm base is developed to assemble supermodules. The results of testing the device are given.