Modelling of the residual atmosphere in vacuum devices with internal adhesive joints

• Published in: Vacuum Vol. 184; p. 109964
• Main Authors: Lunin, Boris S., Kreisberg, Valery A., Zakharyan, Robert A., Basarab, Mikhail A.
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01-02-2021
• Subjects: Adhesive compounds; Degassing kinetics; Mass spectrometry; Specific rate of outgassing; Adhesive compounds; Specific rate of outgassing; Degassing kinetics; Mass spectrometry
• ISSN: 0042-207X; 1879-2715
• DOI: 10.1016/j.vacuum.2020.109964

The joint of the internal parts of various vacuum devices with adhesive allows you to simplify the assembly technology and reduce their cost. However, the use of adhesive leads to the release of volatile products into the internal volume of the device. The specific rates of vacuum release of the main volatile compounds in the temperature range of 25–150 °C from a number of heat-resistant adhesives used in modern instrumentation were determined by means of the method of kinetic thermodesorption mass spectrometry. A method for determining the initial concentration of volatile compounds and diffusion coefficients in the hardened adhesive is proposed. The gas evolution from the hardened adhesive after preliminary thermal vacuum degassing was simulated. The results obtained made it possible to make a rational choice of adhesive for the internal adhesive joints of vacuum devices and their degassing modes.
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•Specific rates of gas release from a number of hardened adhesives are determined.•A method is proposed for determining the concentration of volatile compounds and diffusion coefficients.•A model of gas evolution from the cured adhesive after high-temperature vacuum degassing is described.•The results allow optimizing the bonding of parts inside vacuum devices.