Core-double-shell CNTs@SO@PDA and Functionalized BNNS as Nano-hybrids for Synergistically Enhancing Mechanical and Breakdown Performances of Epoxy with Sandwich-like Structure

• Published in: Fibers and polymers Vol. 23; no. 7; pp. 2030 - 2041
• Main Authors: Gou, Bin, Xie, Congzhen, Wang, Rui, Xu, Huasong, Zhou, Jiangang, Li, Licheng
• Format: Journal Article
• Language: English
• Published: Seoul The Korean Fiber Society 01-07-2022; Springer Nature B.V; 한국섬유공학회
• Subjects: Boron nitride; Breakdown; Carbon; Carbon nanotubes; Chemistry; Chemistry and Materials Science; Electric fields; Electric properties; Insulation; Nanocomposites; Optimization; Polymer Sciences; Shielding; Tensile strength; 섬유공학; Sandwich-like structure; Carbon nanotubes; Boron nitride nanosheets; Nanocomposites; Core-double-shell
• ISSN: 1229-9197; 1875-0052
• DOI: 10.1007/s12221-022-4127-y

Carbon-based nanofillers reinforced composites with superb mechanical and electric properties are of growing importance in numerous applications. However, the ultra-high conductivities of carbon-based nanofillers will severely degrade the insulating performance of the polymer, restricting the implementation in electronic domain and power system. Herein, core-double-shell carbon nanotubes coated with silica and polydopamine (CNTs@SO@PDA) are prepared, significantly improving the tensile strength of the composite while maintaining its insulating property. Meanwhile, the sandwich-structured composite which is consisted of CNTs@SO@PDA/epoxy as central layer and boron nitride nanosheets coated by polydopamine (BNNS@PDA) filled epoxy as shielding layers achieved excellent breakdown strength of 19.5 kV/mm as well as superb tensile strength of 64.84 MPa, increasing about 13.37 % and 24.24 % compared with neat epoxy respectively. The simulation results demonstrate the electric field optimization and redistribution effect of sandwich-structured nanocomposites. This work provides a method for fabricating epoxy nanocomposite with marvelous mechanical and insulating properties, which can be applied to future electronic protectors and insulation equipment.