Comparisons of CTH Simulations with Measured Wave Profiles for Simple Flyer Plate Experiments

• Published in: Journal of dynamic behavior of materials Vol. 2; no. 3; pp. 365 - 371
• Main Authors: Thomas, S. A., Veeser, L. R., Turley, W. D., Hixson, R. S.
• Format: Journal Article
• Language: English
• Published: Cham Springer International Publishing 01-09-2016; Springer Nature B.V
• Subjects: Chemistry and Materials Science; Materials Science; Metallic Materials; Solid Mechanics; Tensile strength; Shock; Hydrocode; Iron; Copper; CTH
• ISSN: 2199-7446; 2199-7454
• DOI: 10.1007/s40870-016-0072-4

We have conducted detailed 2-dimensional hydrodynamics calculations to assess the quality of simulations commonly used to design and analyze simple shock compression experiments. Such simple shock experiments also contain data where dynamic properties of materials are integrated together. We wished to assess how well the chosen computer hydrodynamic code could do at capturing both the simple parts of the experiments and the integral parts. We began with very simple shock experiments, in which we examined the effects of the equation of state and the compressional and tensile strength models. We increased complexity to include spallation in copper and iron and a solid–solid phase transformation in iron to assess the quality of the damage and phase transformation simulations. For experiments with a window, the response of both the sample and the window are integrated together, providing a good test of the material models. While CTH physics models are not perfect and do not reproduce all experimental details well, we find the models are useful; the simulations are adequate for understanding much of the dynamic process and for planning experiments. However, higher complexity in the simulations, such as adding in spall, led to greater differences between simulation and experiment. This comparison of simulation to experiment may help guide future development of hydrodynamics codes so that they better capture the underlying physics.