The thermal and dielectric properties of diamond/SiC composites prepared by polymer impregnation and pyrolysis

• Published in: Carbon Letters Vol. 33; no. 2; pp. 597 - 604
• Main Authors: Liu, Pengfei, He, Xinbo, Qu, Xuanhui
• Format: Journal Article
• Language: English
• Published: Incheon Springer Nature B.V 01-03-2023
• Subjects: Complex permittivity; Composite materials; Diamonds; Dielectric properties; Electrical properties; Graphite; Heat conductivity; Heat transfer; High temperature; Interfacial bonding; Polymers; Pyrolysis; Raw materials; Silicon carbide; Substrates; Thermal conductivity; Thermal stability; Thermogravimetric analysis
• ISSN: 1976-4251; 2233-4998
• DOI: 10.1007/s42823-022-00448-1

This article reported a simple method for preparing diamond/SiC composites by polymer impregnation and pyrolysis (PIP) process, and the advantages of this method were discussed. Only diamond and SiC were contained in the diamond/SiC composite prepared by PIP process, and the diamond particles remained thermally stable up until the pyrolysis temperature was increased to 1600 °C. The pyrolysis temperature has a significant impact on the thermal conductivity and dielectric properties of composites. The thermal conductivity of the composite reaches a maximum value of 63.9 W/mK when the pyrolysis temperature is 1600 °C, and the minimum values of the real and imaginary part of the complex permittivity are 19.5 and 0.77, respectively. The PIP process is a quick and easy method to prepare diamond/SiC composites without needing expensive equipment, and it is of importance for promoting its application in the field of electric packaging substrate.