A new multiple wavelength ellipsometric imager: design, limitations and applications

A new multiple wavelength ellipsometric imager: design, limitations and applications

Spectroscopic ellipsometry is a very useful non-destructive technique to characterise the thickness and composition of multilayers with a spatial resolution of 20×40 μm. The present way to map a sample is to scan the surface of the wafer with this spatial resolution. The new multiple wavelength elli...

Full description

Saved in:
Bibliographic Details
Published in:Thin solid films Vol. 455; pp. 809 - 818
Main Authors: Boher, P., Thomas, O., Piel, J.P., Stehle, J.L.
Format: Journal Article
Language:English
Published: Elsevier B.V 01-05-2004
Subjects:
Imaging
Microscopy
Spectroscopic ellipsometry
Spectroscopic ellipsometry
Microscopy
Imaging
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Spectroscopic ellipsometry is a very useful non-destructive technique to characterise the thickness and composition of multilayers with a spatial resolution of 20×40 μm. The present way to map a sample is to scan the surface of the wafer with this spatial resolution. The new multiple wavelength ellipsometric imager discussed in this paper enables to acquire the full image with several wavelengths in a few seconds. First results obtained on standard SiO 2/Si samples are described and the system performances in terms of accuracy, spatial resolution and signal over noise ratio are discussed. Effect of defects such as achromatism, anamorphose and boundary diffraction are characterised.
ISSN:0040-6090
1879-2731
DOI:10.1016/j.tsf.2004.02.030