Evolution of Microstructure, Texture and Topography during Cold Rolling and Recrystallization of Ni–5at.%W Alloy Substrate for Coated Conductors

• Published in: Crystals (Basel) Vol. 9; no. 11; p. 604
• Main Authors: Zhang, Chenxi, Suo, Hongli, Zhang, Zili, Wang, Qiuliang, Wang, Yingxia, Ma, Lin, Liu, Min, Ji, Yaotang, Li, Jiazhi
• Format: Journal Article
• Language: English
• Published: Basel MDPI AG 01-11-2019
• Subjects: Cold; Cold rolling; Cold working; Conductors; Copper; crystal orientation; Cube texture; Deformation; ebsd; Grain boundaries; Heat; Heat treatment; High temperature superconductors; Microstructure; ni5w alloy substrate; Nickel base alloys; Nucleation; Orientation; Recrystallization; rolling; Rolling direction; Rolling texture; Substrates; Surface layers
• ISSN: 2073-4352; 2073-4352
• DOI: 10.3390/cryst9110604

In this work, the effect of cold rolling and heat treatment upon the microstructure and texture of the surface layer and cross-section of Ni5W alloy substrate was analyzed via the EBSD technique. A typical copper deformation texture was shown by the cold-rolled Ni5W alloy substrate. The cube-oriented nuclei were attributed to the rolling direction–transverse direction (RD-TD) plane due to the presence of copper and S rolling textures. Typical large-shape cold-rolled microstructure was presented by the RD-ND surface in the cube-oriented area. During the recrystallization process, the cube-oriented grains did not have a nucleation quantity advantage, but they did have an obvious growth advantage compared with other orientation grains. They can form a strong cube texture by absorbing the random orientation and rolling orientation through the migration of large-angle grain boundaries.