180-GHz Broadside Radiation Bond-Wire Antenna for Short-Range Wireless Communication

• Published in: IEEE transactions on components, packaging, and manufacturing technology (2011) Vol. 11; no. 3; pp. 530 - 532
• Main Authors: Bakshi, Harshpreet S., Dong, Shenggang, Momson, Ibukunoluwa, Chacon, Diego, Chen, Zhe, Choi, Wooyeol, Blanchard, Andrew J., O, Kenneth K.
• Format: Journal Article
• Language: English
• Published: Piscataway IEEE 01-03-2021; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Bond-wire antenna; complementary metal oxide semiconductor (CMOS); integrated circuit (IC); Manufacturing; Packaging; wireless communication; Wireless communications
• ISSN: 2156-3950; 2156-3985
• DOI: 10.1109/TCPMT.2021.3053558

A technique for realizing an efficient broadside radiation bond-wire antenna for short-range wireless communication is demonstrated. The bond wire forming the antenna is located around <inline-formula> <tex-math notation="LaTeX">375~\mu \text{m} </tex-math></inline-formula> (<inline-formula> <tex-math notation="LaTeX">\sim \lambda </tex-math></inline-formula>/4 at 180 GHz) above the ground plane on a printed circuit board (PCB) for constructive interference of reflected waves from the PCB and that radiated from the antenna. At 178.3 GHz, a gold bond wire shaped in a half loop and terminated on a bond pad of a neighboring chip 975-<inline-formula> <tex-math notation="LaTeX">\mu \text{m} </tex-math></inline-formula> away exhibits a measured peak gain of 2.5 dB at the <inline-formula> <tex-math notation="LaTeX">\phi = 90^{\circ } </tex-math></inline-formula> plane. The antenna also exhibits >20 GHz measured −10-dB <inline-formula> <tex-math notation="LaTeX">\vert \text{S}_{11}\vert </tex-math></inline-formula> bandwidth. The simulated efficiency is 52%.