Experimental I – V(T) and C – V Analysis of Si Planar p-TFETs on Ultrathin Body

We present the experimental analysis of planar Si p-tunnel FETs (TFETs) fabricated on ultrathin body Silicon on Insulator (SOI) substrates by an optimized dopant implantation into silicide process. The average subthreshold swing of such planar TFETs reaches 75 mV/decade over four orders of magnitude...

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Published in:IEEE transactions on electron devices Vol. 63; no. 12; pp. 5036 - 5040
Main Authors: Chang Liu, Qinghua Han, Glass, Stefan, Gia Vinh Luong, Narimani, Keyvan, Tiedemann, Andreas T., Fox, Alfred, Wenjie Yu, Xi Wang, Mantl, Siegfried, Qing-Tai Zhao
Format: Journal Article
Language:English
Published: New York IEEE 01-12-2016
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
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Abstract We present the experimental analysis of planar Si p-tunnel FETs (TFETs) fabricated on ultrathin body Silicon on Insulator (SOI) substrates by an optimized dopant implantation into silicide process. The average subthreshold swing of such planar TFETs reaches 75 mV/decade over four orders of magnitude of drain current. Emphasis is placed on the capacitance- voltage analysis of TFETs. In contrast to simulation predictions, we provide experimental evidence that the contribution of Cgs to the total gate capacitance increases at on-state, which in turn results in a decrease of the gate-to-drain capacitance Cgd. This beneficial effect could result in a reduction of the Miller capacitance effect in TFETs-based circuits.
AbstractList We present the experimental analysis of planar Si p-tunnel FETs (TFETs) fabricated on ultrathin body Silicon on Insulator (SOI) substrates by an optimized dopant implantation into silicide process. The average subthreshold swing of such planar TFETs reaches 75 mV/decade over four orders of magnitude of drain current. Emphasis is placed on the capacitance- voltage analysis of TFETs. In contrast to simulation predictions, we provide experimental evidence that the contribution of Cgs to the total gate capacitance increases at on-state, which in turn results in a decrease of the gate-to-drain capacitance Cgd. This beneficial effect could result in a reduction of the Miller capacitance effect in TFETs-based circuits.
We present the experimental analysis of planar Si p-tunnel FETs (TFETs) fabricated on ultrathin body Silicon on Insulator (SOI) substrates by an optimized dopant implantation into silicide process. The average subthreshold swing of such planar TFETs reaches 75 mV/decade over four orders of magnitude of drain current. Emphasis is placed on the capacitance–voltage analysis of TFETs. In contrast to simulation predictions, we provide experimental evidence that the contribution of [Formula Omitted] to the total gate capacitance increases at on-state, which in turn results in a decrease of the gate-to-drain capacitance [Formula Omitted]. This beneficial effect could result in a reduction of the Miller capacitance effect in TFETs-based circuits.
Author Narimani, Keyvan
Chang Liu
Gia Vinh Luong
Glass, Stefan
Fox, Alfred
Tiedemann, Andreas T.
Qing-Tai Zhao
Qinghua Han
Wenjie Yu
Mantl, Siegfried
Xi Wang
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crossref_primary_10_1016_j_sse_2018_03_006
crossref_primary_10_1109_JEDS_2019_2947695
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Snippet We present the experimental analysis of planar Si p-tunnel FETs (TFETs) fabricated on ultrathin body Silicon on Insulator (SOI) substrates by an optimized...
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SubjectTerms Annealing
Capacitance
Capacitance-voltage characteristics
Miller capacitance
Si planar tunnel FET TFET
Silicides
Silicon substrates
Silicon-on-insulator
SOI (semiconductors)
TFET
TFETs
ultrathin body (UTB)
Title Experimental I – V(T) and C – V Analysis of Si Planar p-TFETs on Ultrathin Body
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