Passive Integration Using FMLF Technique for Integrated Boost Resonant Converters

• Published in: IEEE transactions on industrial electronics (1982) Vol. 67; no. 5; pp. 3756 - 3766
• Main Authors: Deng, Cheng, Yong, Masiqian, Rodriguez, Luciano Andres Garcia, Balda, Juan Carlos, Li, Rui
• Format: Journal Article
• Language: English
• Published: New York IEEE 01-05-2020; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Capacitors; Conductors; Converters; Dielectric films; Distributed electromagnetic component model; distributed parasitic capacitance; Electric power generation; Energy conversion efficiency; flexible multilayer foil (FMLF) integration techniques; Foils; Inductors; Insulation; integrated boost series resonant converter; Multilayers; Passive components; Power transformer insulation; resonant converters; Windings
• ISSN: 0278-0046; 1557-9948
• DOI: 10.1109/TIE.2019.2918493

As a high-efficiency converter for photovoltaic power generation, the integrated boost series resonant (IBSR) converter includes three inductors, two capacitors, and one transformer, which occupy a significant volume. In order to further increase the power density, this paper proposes a novel passive integrated unit with the flexible multilayer foil integration technique for the above six passive components. First of all, the distributed electromagnetic component model of one new flexible three-layer film shows that the distributed parasitic capacitors formed by the insulation film are combined into the resonant capacitance. Then, the configuration of the proposed integrated unit is described in detail, and the electromagnetic analysis is given. Furthermore, the design procedure for the proposed integrated unit is demonstrated. Finally, a prototype for a 350 W IBSR converter has been built and the experimental results prove the validity of the proposed idea.