Electromigration-induced plastic deformation in passivated metal lines

• Published in: Applied physics letters Vol. 81; no. 22; pp. 4168 - 4170
• Main Authors: Valek, B. C., Bravman, J. C., Tamura, N., MacDowell, A. A., Celestre, R. S., Padmore, H. A., Spolenak, R., Brown, W. L., Batterman, B. W., Patel, J. R.
• Format: Journal Article
• Language: English
• Published: United States 25-11-2002
• Subjects: DEFORMATION; ELECTROPHORESIS; MATERIALS SCIENCE; PLASTICS; RELAXATION; SHEAR; STRESSES; X-RAY MICRODIFFRACTION ELECTROMIGRATION THIN FILMS INTERCONNECTS
• ISSN: 0003-6951; 1077-3118
• DOI: 10.1063/1.1525880

We have used scanning white beam x-ray microdiffraction to study microstructural evolution during an in situ electromigration experiment on a passivated Al(Cu) test line. The data show plastic deformation and grain rotations occurring under the influence of electromigration, seen as broadening, movement, and splitting of reflections diffracted from individual metal grains. We believe this deformation is due to localized shear stresses that arise due to the inhomogeneous transfer of metal along the line. Deviatoric stress measurements show changes in the components of stress within the line, including relaxation of stress when current is removed.