Thermal conductivity changes of photo-elastic semiconductor excited in gravitational field with hydrostatic initial stress and internal heat source

• Published in: Waves in random and complex media Vol. 34; no. 1; pp. 287 - 306
• Main Authors: Mahdy, A.M.S., Lotfy, Kh, El-Bary, A. A.
• Format: Journal Article
• Language: English
• Published: Abingdon Taylor & Francis 02-01-2024; Taylor & Francis Ltd
• Subjects: Conduction heating; Conductive heat transfer; Dual-phase-lag model; Elastic deformation; Free surfaces; Gravitational fields; gravity; Heat conductivity; hydrostatic initial stress; Initial stresses; internal heat source; Mathematical models; Parameters; Phase lag; photo-thermoelasticity theory; Semiconductor materials; Thermal conductivity; variable thermal conductivity
• ISSN: 1745-5030; 1745-5049
• DOI: 10.1080/17455030.2021.1908642

In this work, the effect of hydrostatic initial stress is studied with the exited semiconductor material. Electrons are exited at the free surface of the elastic semiconductor medium using the photo-thermal-elastic theory during the transport (diffusion) process. The thermal memories are due to the dual-phase-lag (DPL) relaxation times of the heat conduction equation with a novel model. In this model, the thermal conductivity is chosen as a linear dependent function of the thermal temperature impact which is variable. The effect of gravitational field is taken into account during the two-dimensional (2D) elastic deformation under the impact of an internal heat source. The Kirchhoff transformation mapping is used. The harmonic wave (normal mode) method is applied for the 2D governing equations to obtain the main physical fields analytically. Some thermal and mechanical forces are applied with other elastic-plasma conditions at the free surface of the semiconductor material to get the complete solutions. Some comparisons used a novel parameters which depend on the DPL model and the differences in the thermal conductivity parameters and they are illustrated graphically and discussed.