Wafer fusion: materials issues and device results

Wafer fusion: materials issues and device results

A large number of novel devices have been recently demonstrated using wafer fusion to integrate materials with different lattice constants. In many cases, devices created using this technique have shown dramatic improvements over those which maintain a single lattice constant. We present device resu...

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Bibliographic Details
Published in:IEEE journal of selected topics in quantum electronics Vol. 3; no. 3; pp. 943 - 951
Main Authors: Black, A., Hawkins, A.R., Margalit, N.M., Babic, D.I., Holmes, A.L., Chang, Y.-L., Abraham, P., Bowers, J.E., Hu, E.L.
Format: Journal Article
Language:English
Published: IEEE 01-06-1997
Subjects:
Conducting materials
Lattices
Mirrors
Optical materials
Semiconductor devices
Semiconductor materials
Substrates
Thermal resistance
Wafer bonding
Wavelength division multiplexing
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Summary:A large number of novel devices have been recently demonstrated using wafer fusion to integrate materials with different lattice constants. In many cases, devices created using this technique have shown dramatic improvements over those which maintain a single lattice constant. We present device results and characterizations of the fused interface between several groups of materials.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:1077-260X
1558-4542
DOI:10.1109/2944.640648