The formation and growth of intermetallics in composite solder

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Bibliographic Details
Published in:	Journal of electronic materials Vol. 22; no. 7; pp. 769 - 777
Main Authors:	YUJING WU, SEES, J. A, POURAGHABAGHER, C, FOSTER, L. A, MARSHALL, J. L, JACOBS, E. G, PINIZZOTTO, R. F
Format:	Journal Article
Language:	English
Published:	New York, NY Institute of Electrical and Electronics Engineers 01-07-1993
Subjects:	Applied sciences Electronics Exact sciences and technology Materials Metals. Metallurgy Solder Intermetallic compound Tin alloy Electronics Copper base alloys Diffusion Microstructure Soldering Interface
Online Access:	Get full text
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Description
ISSN:	0361-5235 1543-186X
DOI:	10.1007/BF02817353