Advances in wire bonding technology for high lead count, high-density devices

Advances in wire bonding technology for high lead count, high-density devices

How present challenges are being met by the innovation taking place in wire-bonding technology is discussed. A wire-bonder system accuracy model is discussed. Factors that affect minimum pad-size requirement and fine pitch capability are described. The requirements for attaining true-bond program po...

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Bibliographic Details
Published in:IEEE transactions on components, hybrids, and manufacturing technology Vol. 11; no. 3; pp. 233 - 239
Main Authors: Shah, G.N., Levine, L.R., Patel, D.I.
Format: Journal Article
Language:English
Published: IEEE 01-09-1988
Subjects:
Application specific integrated circuits
Assembly
Bonding processes
Geometry
Integrated circuit packaging
Lead compounds
Manufacturing automation
Packaging machines
Semiconductor devices
Wire
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Description
Summary:How present challenges are being met by the innovation taking place in wire-bonding technology is discussed. A wire-bonder system accuracy model is discussed. Factors that affect minimum pad-size requirement and fine pitch capability are described. The requirements for attaining true-bond program portability are analyzed. Results of designed experiments undertaken to better understand the wire-bonding process are also presented.< >
ISSN:0148-6411
1558-3082
DOI:10.1109/33.16646