Improvement for electrical conductivity of Ti3SiC2/Cu joint brazed with a novel Sn6Ag7Ni4Co2Ti low-melting high entropy alloy filler

• Published in: Materials letters Vol. 322; p. 132488
• Main Authors: Nai, Xin, Chen, Haiyan, Zhao, Shuai, Liu, Fenjun, Shen, Zhikang, Li, Wenya
• Format: Journal Article
• Language: English
• Published: Elsevier B.V 01-09-2022
• Subjects: Ceramics; Electrical properties; Interfaces; Microstructure; Welding; Interfaces; Ceramics; Welding; Electrical properties; Microstructure
• ISSN: 0167-577X; 1873-4979
• DOI: 10.1016/j.matlet.2022.132488

•A novel Sn6Ag7Ni4Co2Ti low-melting High-entropy filler was designed and fabricated.•Ti3SiC2/Cu joint brazed with Sn6Ag7Ni4Co2Ti High-entropy filler has a lower resistance.•High-entropy and hysteresis effects play a role in simplifying interface structure.
Reducing the interfacial electrical resistance of Ti3SiC2/Cu joint has significant value to promote its application in the field of electrical contact. In the study, a novel Sn6Ag7Ni4Co2Ti low-melting high entropy alloy (HEA) was designed and fabricated, and a sound Ti3SiC2/Cu brazed joint was obtained using above filler. The interface of Ti3SiC2/Cu joint brazed with Sn6Ag7Ni4Co2Ti filler is mainly composed of Ag(s,s), Cu(s,s) and a few (Ni, Co)2Si. Compared with Ti3SiC2/Cu joint brazed with Ag-26.7Cu-4.5Ti filler, the electrical resistance of the joint brazed with Sn6Ag7Ni4Co2Ti filler is lower at all test temperatures, which is reduced by up to 15.99% when the test temperature is 300 °C.