Analysis of the Influence of Quantum-Mechanical Processes on the Possibilities of Determining the Low Degree of Curing a Binder when Molding Products from Polymer Composite Materials

• Published in: Polymer science. Series D, Glues and sealing materials Vol. 11; no. 3; pp. 334 - 338
• Main Authors: Zorin, V. A., Baurova, N. I., Kosenko, E. A.
• Format: Journal Article
• Language: English
• Published: Moscow Pleiades Publishing 01-07-2018; Springer Nature B.V
• Subjects: Chemistry; Chemistry and Materials Science; Composite materials; Curing; Diagnostic systems; Polymer matrix composites; Polymer Sciences; Polymers; polymer; Debye temperature; polymerization; phonon; thermal conductivity; methods of nondestructive testing
• ISSN: 1995-4212; 1995-4220
• DOI: 10.1134/S1995421218030255

The quantum-mechanical nature of thermal processes in the diagnosis of incomplete curing of a polymer binder is considered in this article. The results obtained in the article may serve as a basis for further research in the development of diagnostic methods for determining the short state of an epoxy polymer with the use of ultrasonic, temperature, and magnetic phenomena.