Wafer bonding technology for silicon-on-lnsulator applications: A review

Wafer bonding technology for silicon-on-lnsulator applications: A review

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Bibliographic Details
Published in:Journal of electronic materials Vol. 21; no. 7; pp. 669 - 676
Main Authors: Mitani, Kiyoshi, Gösele, Ulrich M.
Format: Journal Article
Language:English
Published: 01-07-1992
Online Access:Get full text
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Description
ISSN:0361-5235
1543-186X
DOI:10.1007/BF02655594