A thermoanalytical study of curing of epoxy-amine binders modified with epoxy-containing silsesquioxane

Results of examinations of the modification of an epoxy-amine binder with MPS-E epoxy-containing silsesquioxane synthesized at the State Research Institute for Chemistry and Technology of Organo-element Compounds (SSC RF GNIIChTEOS) are under consideration. The optimal composition of the binder and...

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Bibliographic Details
Published in:	Polymer science. Series D, Glues and sealing materials Vol. 8; no. 2; pp. 133 - 137
Main Authors:	Akopova, T. A., Olikhova, Yu. V., Osipchik, V. S.
Format:	Journal Article
Language:	English
Published:	Moscow Pleiades Publishing 01-04-2015
Subjects:	Chemistry Chemistry and Materials Science Polymer Sciences amine curing agent epoxy resin oligomeric silsesquioxane heat resistance modification of epoxy binder epoxy organosilicon compounds
Online Access:	Get full text
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Summary:	Results of examinations of the modification of an epoxy-amine binder with MPS-E epoxy-containing silsesquioxane synthesized at the State Research Institute for Chemistry and Technology of Organo-element Compounds (SSC RF GNIIChTEOS) are under consideration. The optimal composition of the binder and the conditions used for its curing by a mixture of aliphatic and aromatic diamines were determined and it was shown that the MPS-E silsesquioxane, along with amines, participates in the curing of the ED-20 epoxy resin, thus resulting in the binder characterized by an increased heat resistance.
ISSN:	1995-4212 1995-4220
DOI:	10.1134/S1995421215020021