Bi-parameter thermal-mechanical reliability of miniaturised electromechanical RF relays for space applications

Bi-parameter thermal-mechanical reliability of miniaturised electromechanical RF relays for space applications

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Bibliographic Details
Published in:Microelectronics and reliability Vol. 150; p. 115222
Main Authors: Marozau, I., Unterhofer, S., Berry, M., Aubry, G., Gonin, P., Enquebecq, R., Dadras, M., Sereda, O.
Format: Journal Article
Language:English
Published: 01-11-2023
Online Access:Get full text
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Description
ISSN:0026-2714
DOI:10.1016/j.microrel.2023.115222