Thermally conductive aluminium nitride-filled epoxy resin (for electronic packaging)
The thermal conductivity and the relative permittivity of an AlN particulate-filled epoxy resin have been investigated as a function of the volume loading ratio of AlN and the temperature. A thermal conductivity of 4 W/mK has been achieved. The observed thermal conductivities depend on the overall s...
Saved in:
| Published in: | Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium pp. 126 - 130 |
|---|---|
| Main Authors: | , |
| Format: | Conference Proceeding |
| Language: | English |
| Published: |
IEEE
1989
|
| Subjects: | |
| Online Access: | Get full text |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Abstract | The thermal conductivity and the relative permittivity of an AlN particulate-filled epoxy resin have been investigated as a function of the volume loading ratio of AlN and the temperature. A thermal conductivity of 4 W/mK has been achieved. The observed thermal conductivities depend on the overall statistics of the particle arrangement in the epoxy matrix. An analysis led the authors to assumed the presence of clusters of AlN in the epoxy matrix. The temperature dependence of the thermal conductivity can be deduced from the room temperature of the thermal conductivity and the measured coefficients of thermal expansion.< > |
|---|---|
| AbstractList | The thermal conductivity and the relative permittivity of an AlN particulate-filled epoxy resin have been investigated as a function of the volume loading ratio of AlN and the temperature. A thermal conductivity of 4 W/mK has been achieved. The observed thermal conductivities depend on the overall statistics of the particle arrangement in the epoxy matrix. An analysis led the authors to assumed the presence of clusters of AlN in the epoxy matrix. The temperature dependence of the thermal conductivity can be deduced from the room temperature of the thermal conductivity and the measured coefficients of thermal expansion.< > |
| Author | Bujard, P. Ansermet, J.P. |
| Author_xml | – sequence: 1 givenname: P. surname: Bujard fullname: Bujard, P. organization: Giba-Geigy Ltd., Fribourg, Switzerland – sequence: 2 givenname: J.P. surname: Ansermet fullname: Ansermet, J.P. organization: Giba-Geigy Ltd., Fribourg, Switzerland |
| BookMark | eNotz7FOwzAQgGEPMEDhAbp5hCElFzeOM6KqUKQiJAhzdbHP5YTjRG6CyNsjAdO_fdJ_Kc5iH0mIJeQrgLy-e2t229fnFdSmXlU6r6oL0TQflDoMYZa2j26yI3-RxDB1HHnqZOQxsaPMcwjkJA399ywTnTjKG98nSYHsmPrIVg5oP_HI8Xh7Jc49hhNd_3ch3h-2zWaX7V8enzb3-8xCCWPmEUnVWum2Qk3ksDWmWKsalAUkKLEF0gCmKrzzoECjosKUa29c23rI1UIs_1wmosOQuMM0H37P1A9IK0xP |
| CitedBy_id | crossref_primary_10_1109_TCPMT_2013_2281212 crossref_primary_10_1016_S0955_2219_99_00282_4 crossref_primary_10_1016_j_compositesa_2005_07_006 crossref_primary_10_1109_TADVP_2003_811546 crossref_primary_10_1016_j_ijheatmasstransfer_2018_11_107 crossref_primary_10_1002_app_27027 crossref_primary_10_1111_j_1151_2916_2000_tb01341_x crossref_primary_10_1109_33_105121 crossref_primary_10_1016_S1359_835X_01_00023_9 crossref_primary_10_1007_s00289_021_04022_z crossref_primary_10_1163_156855400750244969 crossref_primary_10_1109_95_335037 crossref_primary_10_1016_j_carbpol_2020_115888 crossref_primary_10_1007_s10948_009_0607_1 crossref_primary_10_3390_polym12122863 |
| ContentType | Conference Proceeding |
| DBID | 6IE 6IL CBEJK RIE RIL |
| DOI | 10.1109/STHERM.1989.76077 |
| DatabaseName | IEEE Electronic Library (IEL) Conference Proceedings IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume IEEE Xplore All Conference Proceedings IEEE Electronic Library Online IEEE Proceedings Order Plans (POP All) 1998-Present |
| DatabaseTitleList | |
| Database_xml | – sequence: 1 dbid: RIE name: IEEE Electronic Library Online url: http://ieeexplore.ieee.org/Xplore/DynWel.jsp sourceTypes: Publisher |
| DeliveryMethod | fulltext_linktorsrc |
| EndPage | 130 |
| ExternalDocumentID | 76077 |
| Genre | orig-research |
| GroupedDBID | 6IE 6IL CBEJK RIE RIL |
| ID | FETCH-LOGICAL-c151t-faae39636b7a6eedab88243913c1ae15ab1e611872fdf1316a3e2854f8dbbf103 |
| IEDL.DBID | RIE |
| IngestDate | Thu Jun 29 18:11:27 EDT 2023 |
| IsPeerReviewed | false |
| IsScholarly | false |
| Language | English |
| LinkModel | DirectLink |
| MergedId | FETCHMERGED-LOGICAL-c151t-faae39636b7a6eedab88243913c1ae15ab1e611872fdf1316a3e2854f8dbbf103 |
| PageCount | 5 |
| ParticipantIDs | ieee_primary_76077 |
| PublicationCentury | 1900 |
| PublicationDate | 19890000 |
| PublicationDateYYYYMMDD | 1989-01-01 |
| PublicationDate_xml | – year: 1989 text: 19890000 |
| PublicationDecade | 1980 |
| PublicationTitle | Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium |
| PublicationTitleAbbrev | STHERM |
| PublicationYear | 1989 |
| Publisher | IEEE |
| Publisher_xml | – name: IEEE |
| Score | 1.2316673 |
| Snippet | The thermal conductivity and the relative permittivity of an AlN particulate-filled epoxy resin have been investigated as a function of the volume loading... |
| SourceID | ieee |
| SourceType | Publisher |
| StartPage | 126 |
| SubjectTerms | Aluminum Conductivity measurement Electronic packaging thermal management Electronics packaging Epoxy resins Temperature dependence Thermal conductivity Thermal expansion Thermal loading Thermal management |
| Title | Thermally conductive aluminium nitride-filled epoxy resin (for electronic packaging) |
| URI | https://ieeexplore.ieee.org/document/76077 |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| link | http://sdu.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV3PS8MwFA5uJ086nPibHDzoIVuzbEl61o1dFHETvI2keYHi7GSu4P5738uGQ_DirZTSloT3M-_7Psaus2htPwclJDgv-sEGYa1Gu_L5oPCDQAxG1LqYmMdXez_8oclJWBgASMNn0KHLdJYfFkVNrbKu0ZkxDdYwud0gtbbHlPjC7mQ6Hj4_dGgEqJOe-yWXkqLF6OA_3zlk7R3ojj_9hJMW24PqiE1xG9F1zudrjoUrcbOid-IOPUpZlfU7R4NclgFEJEhf4JhNf605VtBlxW8wHeU7lRuOxfFbkiS6bbOX0XB6NxZbIQRRYEBeiegcKLQU7Y3T-BfOY15MkFlVSAdy4LwETbrhvRiiVFI7BYSMjDZ4H2WmjlmzWlRwwnhwWd6zOvcRVN8RLjUWxMLe81E5I_0pa9F6zD42XBeztBRnf908Z_ubeStqR1yw5mpZwyVrfIb6Ku3NNxESlE8 |
| link.rule.ids | 310,311,782,786,791,792,798,4054,4055,27934,54767 |
| linkProvider | IEEE |
| linkToHtml | http://sdu.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV1NS8MwGA5uHvSkw4nf5uBBD9mapU3Ss25M3Ia4Ct5G0iRQnJ3MFdy_9002NgQv3kopbUl4P_M-z4PQTeSkjFPLCLVKk9hIQ6TkYFc6TXKdGM9g5FsXYzF6kw_dDU1OwMJYa8PwmW35y3CWb2Z55VtlbcEjIWpoN4kFFyus1vqgEl7ZHmf97suw5YeAWuHJX4IpIV70Dv7zpUPU3MLu8PMmoDTQji2PUAYbCc5zOl1iKF09Oyv4J6zApxRlUX1gMMl5YSxxHtRnMOTT30sMNXRR4ltISPFW5wZDefweRInumui1183u-2QthUByCMkL4pSyDGyFa6E4_IXSkBl70CzLqbI0UZpa7pXDO844yihXzHpspJNGa0cjdozq5ay0JwgbFaUdyVPtLIuVR6a63POwd7RjSlB9ihp-PSafK7aLSViKs79uXqO9fjYcTAaPo6dztL-avvLNiQtUX8wre4lqX6a6Cvv0Awr-l6A |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=proceeding&rft.title=Fifth+Annual+IEEE+Semiconductor+Thermal+and+Temperature+Measurement+Symposium&rft.atitle=Thermally+conductive+aluminium+nitride-filled+epoxy+resin+%28for+electronic+packaging%29&rft.au=Bujard%2C+P.&rft.au=Ansermet%2C+J.P.&rft.date=1989-01-01&rft.pub=IEEE&rft.spage=126&rft.epage=130&rft_id=info:doi/10.1109%2FSTHERM.1989.76077&rft.externalDocID=76077 |