Thermally conductive aluminium nitride-filled epoxy resin (for electronic packaging)

• Published in: Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium pp. 126 - 130
• Main Authors: Bujard, P., Ansermet, J.P.
• Format: Conference Proceeding
• Language: English
• Published: IEEE 1989
• Subjects: Aluminum; Conductivity measurement; Electronic packaging thermal management; Electronics packaging; Epoxy resins; Temperature dependence; Thermal conductivity; Thermal expansion; Thermal loading; Thermal management
• DOI: 10.1109/STHERM.1989.76077

The thermal conductivity and the relative permittivity of an AlN particulate-filled epoxy resin have been investigated as a function of the volume loading ratio of AlN and the temperature. A thermal conductivity of 4 W/mK has been achieved. The observed thermal conductivities depend on the overall statistics of the particle arrangement in the epoxy matrix. An analysis led the authors to assumed the presence of clusters of AlN in the epoxy matrix. The temperature dependence of the thermal conductivity can be deduced from the room temperature of the thermal conductivity and the measured coefficients of thermal expansion.< >