Thermal cycling induced wiping wear of connector contacts at 150°C

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Bibliographic Details
Published in:IEEE transactions on components and packaging technologies Vol. 22; no. 1; pp. 72 - 78
Main Authors: Leung, C.H., Lee, A.
Format: Journal Article
Language:English
Published: 01-03-1999
Online Access:Get full text
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Description
ISSN:1521-3331
DOI:10.1109/6144.759355