Technological work burnout: conceptualization, measure development and validation
Purpose As workplaces increasingly integrate digital technologies, understanding their impact on employee burnout has become imperative. This paper introduces the Technological Work Burnout Scale (TWBS), an innovative tool developed to measure the influence of technology on workplace burnout. Design...
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Published in: | Kybernetes |
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Main Authors: | , , , , |
Format: | Journal Article |
Language: | English |
Published: |
25-09-2024
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Online Access: | Get full text |
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Summary: | Purpose As workplaces increasingly integrate digital technologies, understanding their impact on employee burnout has become imperative. This paper introduces the Technological Work Burnout Scale (TWBS), an innovative tool developed to measure the influence of technology on workplace burnout. Design/methodology/approach To bridge the existing gap in this area of study, our research employed Hinkin’s (1998) psychometric methodologies, creating a structured process for developing the TWBS, which included initial item generation, item reduction with reliability estimation, confirmatory factor analysis and tests for both convergent and discriminant validity. By applying these procedures, we validated the scale across various professional settings (in three different samples), ensuring its robustness and applicability in diverse technological work environments. Findings The TWBS demonstrates a consistent unidimensional structure, effectively capturing the multifaceted nature of burnout in the digital age. Originality/value Through this scale, we provide insights into how technology influences employee well-being and organizational health, offering a valuable tool for organizations to assess and manage the growing issue of technological work burnout. Our study not only enriches the academic understanding of burnout in the context of technological integration in workplaces but also offers practical implications for addressing this critical concern. |
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ISSN: | 0368-492X |
DOI: | 10.1108/K-05-2024-1243 |