Electrophysical Parameters of PIN Photodiodes Irradiated with 60Co γ-Quanta

The results of studies of the changes in the electrophysical parameters of PIN photodiodes made on monocrystalline silicon wafers of the p -type of conductivity of orientation (100) with ρ = 1000 Ohm cm, when irradiated with γ-quanta from a 60 Co source, are presented. It is established that as a re...

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Bibliographic Details
Published in:Russian microelectronics Vol. 52; no. 6; pp. 504 - 509
Main Authors: Kovalchuk, N. S., Lastovskii, S. B., Odzhaev, V. B., Petlitskii, A. N., Prosolovich, V. S., Shestovskii, D. V., Yavid, V. Yu, Yankovskii, Yu. N.
Format: Journal Article
Language:English
Published: Moscow Pleiades Publishing 2023
Springer Nature B.V
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Summary:The results of studies of the changes in the electrophysical parameters of PIN photodiodes made on monocrystalline silicon wafers of the p -type of conductivity of orientation (100) with ρ = 1000 Ohm cm, when irradiated with γ-quanta from a 60 Co source, are presented. It is established that as a result of the irradiation of the PIN photodiodes doses up to 2 × 10 15 quanta/cm 2 results in an increase in the reverse dark current by more than an order of magnitude. However, the shape of the curve of the dependence of the current on the applied reverse voltage of irradiated PIN photodiodes does not change qualitatively, just as for the original devices, there are three regions with different dependencies of the current on voltage—sublinear, superlinear, and linear—caused by different mechanisms of the generation-recombination processes in the depletion region of the p–n transition. The main reason for the increase in the reverse current of PIN photodiodes as a result of the irradiation of γ-quanta is the formation of the generation-recombination centers of radiation origin due to the condensation of the primary radiation defects (vacancies and/or self-interstitial atoms) on the technological residual structural defects formed both during the growth of silicon single crystals and during subsequent high-temperature treatments during the formation of devices.
ISSN:1063-7397
1608-3415
DOI:10.1134/S1063739723700737