A novel physical vapor deposition setup applying high-frequency currents: Deposition of Cu thin films

• Published in: Vacuum Vol. 232; p. 113839
• Main Authors: Poimenidis, Ioannis A., Liapakis, Michalis, Klini, Argyro, Farsari, Maria, Moustaizis, Stavros D., Konsolakis, Michalis, Loukakos, Panagiotis A.
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01-02-2025
• Subjects: Cu deposition; Eddy current; Physical vapor deposition; Zero voltage switching heater; Physical vapor deposition; Zero voltage switching heater; Eddy current; Cu deposition
• ISSN: 0042-207X
• DOI: 10.1016/j.vacuum.2024.113839

A pioneering laboratory apparatus of physical vapor deposition (PVD) for thin film fabrication is herein introduced. This innovative setup harnesses high-frequency currents (Eddy currents) and a Zero-Voltage Switching (ZVS) heater to sublimate the sacrificial material. The as-fabricated system offers low energy consumption and fast deposition time, leading to the formation and growth of thin films in various thicknesses. To reveal its effectiveness, Cu thin films were deposited on Si wafers. Morphological, structural, and surface profile characterizations confirmed the growth of thin films consisting of Cu nanoparticles. Also, a parametric study of deposition time was conducted to determine the optimum conditions for the thin film fabrication.
[Display omitted]
•New physical vapor deposition setup.•Electromagnetic field application for highly efficient deposition process.•Fast growth of Cu nanoparticles thin film.