Solution-Based Assembly of Conductive Gold Film on Flexible Polymer Substrates

• Published in: Langmuir Vol. 20; no. 20; pp. 8870 - 8876
• Main Authors: Supriya, Lakshmi, Claus, Richard O
• Format: Journal Article
• Language: English
• Published: United States American Chemical Society 28-09-2004
• ISSN: 0743-7463; 1520-5827
• DOI: 10.1021/la048999h

Conductive films of gold were assembled on flexible polymer substrates such as Kapton and polyethylene using a solution-based process. The polymer substrates were modified by using argon plasma and subsequent coupling of silanes with amino- or mercapto- terminal groups. These modified surfaces were examined by X-ray photoelectron spectroscopy and contact angle measurements. Colloidal gold was assembled onto the silane-modified surface from solution. The gold particles are attached to the surface by covalent interactions with the thiol or amine group. Formation of a conductive film is achieved by increasing the coverage of gold by using a “seeding” method to increase the size of the attached gold particles. Field emission scanning electron microscopy was used to follow the growth of the film. The surface resistance of the films, measured using a four-point probe, was about 1 Ω/sq.