Efficient probing schemes for fine-pitch pads of InFO wafer-level chip-scale package

• Published in: 2016 53nd ACM/EDAC/IEEE Design Automation Conference (DAC) pp. 1 - 6
• Main Authors: Yu-Chieh Huang, Bing-Yang Lin, Cheng-Wen Wu, Mincent Lee, Hao Chen, Hung-Chih Lin, Ching-Nen Peng, Min-Jer Wang
• Format: Conference Proceeding
• Language: English
• Published: IEEE 05-06-2016
• Subjects: 2.5D IC; 3D IC; Bonding; Circuit faults; InFO WLCSP; Integrated circuits; interconnect test; Needles; pre-bond test; Probes; Testing; Three-dimensional displays; wafer probing; wafer test
• DOI: 10.1145/2897937.2898015

With the increasing demand of super high scale of integration and small form factor in advanced semiconductor products, especially those that integrate DRAM and logic dies, 3D IC and Wafer-Level Chip-Scale Packaging (WLCSP) are considered promising approaches. In Integrated Fan-Out (InFO) WLCSP, a large number of fine-pitch pads, where neighboring pads cannot be probed simultaneously due to insufficient pitch, are used as the contact interfaces of inter-die interconnections. If the fine-pitch pads cannot be probed, the interconnections between the pads and boundary scan cells (BSCs) cannot be tested, which can lead to higher defect level. From industrial investigation, untested fine-pitch pads lead to 1-2% test coverage loss. To improve the overall test coverage, in this paper, we propose a pre-bond probing methodology for fine-pitch pads of InFO WLCSP. By the proposed probing schemes, open/short faults on the interconnects between the fine-pitch pads and BSCs can be all tested by the ATE. Moreover, for short faults that only occur between adjacent pads (interconnects), we propose a grouping method to determine the test patterns at each probing stage, which can minimize the test time. We also show that our method can achieve 100% test coverage of open/short faults.