Solution Chemical Constraints in the Chemical-Mechanical Polishing of Copper: Aqueous Stability Diagrams for the Cu-Hsub 2 sub and Cu-NHsub 3-Hsub 2 sub Systems
A general graphical approach to the solution chemistry of chemical mechanical polishing is presented with the aid of a variety of aqueous stability diagrams, such as Eh-pH (Pourbaix), log{Metal}-pH, and log{Ligand}-pH diagrams. The common thermodynamic origin of these diagrams is highlighted. The im...
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| Published in: | Journal of electronic materials Vol. 25; no. 10; pp. 1599 - 1607 |
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| Main Authors: | , |
| Format: | Journal Article |
| Language: | English |
| Published: |
01-10-1996
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| Online Access: | Get full text |
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