i\In situ\-i\ temperature measurements of PQFPs during infrared reflow
This paper presents an experimental investigation where temperature measurements using thermocouples were made at several locations on J-leaded plastic quad-flat packs (PQFPs) and printed wiring boards during the reflow soldering process. Both moisture saturated and dry packages were studied, with l...
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| Published in: | Circuit world Vol. 24; no. 4; pp. 29 - 32 |
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| Main Authors: | , , , |
| Format: | Journal Article |
| Language: | English |
| Published: |
01-08-1998
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| Online Access: | Get full text |
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| Abstract | This paper presents an experimental investigation where temperature measurements using thermocouples were made at several locations on J-leaded plastic quad-flat packs (PQFPs) and printed wiring boards during the reflow soldering process. Both moisture saturated and dry packages were studied, with little difference found in the measured temperature on the package surfaces. The temperature at the component lead was found to be a good approximation to the temperatures observed near the die. This provides an externally measurable parameter to assess delamination and popcorning. (Original abstract - amended) |
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| AbstractList | This paper presents an experimental investigation where temperature measurements using thermocouples were made at several locations on J-leaded plastic quad-flat packs (PQFPs) and printed wiring boards during the reflow soldering process. Both moisture saturated and dry packages were studied, with little difference found in the measured temperature on the package surfaces. The temperature at the component lead was found to be a good approximation to the temperatures observed near the die. This provides an externally measurable parameter to assess delamination and popcorning. (Original abstract - amended) |
| Author | Dube, M Pecht, M Beatty, K E Dishongh, T J |
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| Title | i\In situ\-i\ temperature measurements of PQFPs during infrared reflow |
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