Characterization of the implantation damage in SiO sub(2) with x-ray photoelectron spectroscopy

X-ray photoelectron spectroscopy (XPS) has been applied to characterize the damage introduced into SiO sub(2) by ion implantation. By measuring the peak width of Si sub(2p) from SiO sub(2) which corresponds to perturbation of the SiO sub(2) network, good depth profiles of the damage have been obtain...

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Bibliographic Details
Published in:Applied physics letters Vol. 48; no. 20; pp. 1398 - 1399
Main Authors: Ajioka, T, Ushio, S
Format: Journal Article
Language:English
Published: 01-01-1986
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Summary:X-ray photoelectron spectroscopy (XPS) has been applied to characterize the damage introduced into SiO sub(2) by ion implantation. By measuring the peak width of Si sub(2p) from SiO sub(2) which corresponds to perturbation of the SiO sub(2) network, good depth profiles of the damage have been obtained for implanted samples and subsequently annealed samples. The results show that the damage distributed more widely than that calculated from energy deposition and that the perturbation of the network is caused not only by radiation damage but also by the existence of impurities in the network. It has been found that the XPS method is effective to understand the atomic structure, and thus, electrical properties of SiO sub(2).
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ISSN:0003-6951