Optimization of the Thermomechanical Reliability of a 65 nm Cu/Low-[Formula Omitted] Large-Die Flip Chip Package

[...] the low-k materials have lower modulus and poorer adhesion compared to the common dielectric materials. [...] thermomechanical failure is one of the major bottlenecks in the development of Cu/low-k larger-die flip chip packages.

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Bibliographic Details
Published in:	IEEE transactions on components and packaging technologies Vol. 32; no. 4; p. 838
Main Authors:	Ong, J.M.G, Tay, A.A.O, Zhang, X, Kripesh, V, Lim, Y.K, Yeo, D, Chan, K.C, Tan, J.B, Hsia, L.C, Sohn, D.K
Format:	Journal Article
Language:	English
Published:	New York The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 01-12-2009
Subjects:	Finite element analysis Optimization Semiconductors Studies
Online Access:	Get full text
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Description
Summary:	[...] the low-k materials have lower modulus and poorer adhesion compared to the common dielectric materials. [...] thermomechanical failure is one of the major bottlenecks in the development of Cu/low-k larger-die flip chip packages.
ISSN:	1521-3331 1557-9972
DOI:	10.1109/TCAPT.2009.2020696