Laser chemical etching of waveguides and quasi -optical devices

• Main Author: Drouet d'Aubigny, Christian Yann Pierre
• Format: Dissertation
• Language: English
• Published: ProQuest Dissertations & Theses 01-01-2003
• Subjects: Astrophysics; Optics
• ISBN: 9780496376506; 0496376500

The terahertz (THz) frequency domain, located at the frontier of radio and light, is the last unexplored region of the electromagnetic spectrum. As technology becomes available, THz systems are finding applications to fields ranging all the way from astronomical and atmospheric remote sensing to space telecommunications, medical imaging, and security. In Astronomy the THz and far infrared (IR) portion of the electromagnetic spectrum (λ = 300 to 10 μm) may hold the answers to countless questions regarding the origin and evolution of the Universe, galaxy, star and planet formation. Over the past decade, advances in telescope and detector technology have for the first time made this regime available to astronomers. Near THz frequencies, metallic hollow waveguide structures become so small, (typically much less than a millimeter), that conventional machining becomes extremely difficult, and in many cases, nearly impossible. Laser induced, micro-chemical etching is a promising new technology that can be used to fabricate three dimensional structures many millimeters across with micrometer accuracy. Laser micromachining of silicon possesses a significant edge over more conventional techniques. It does not require the use of masks and is not confined to crystal planes. A non-contact process, it eliminates tool wear and vibration problems associated with classical milling machines. At the University of Arizona we have constructed the first such laser micromachining system optimized for the fabrication of THz and far IR waveguide and quasi-optical components. The system can machine structures up to 50 mm in diameter, down to a few microns accuracy in a few minutes and with a remarkable surface finish. A variety of THz devices have been fabricated using this technique, their design, fabrication, assembly and theoretical performance is described in the chapters that follow.