Pressureless Bonding by Use of Cu and Sn Mixed Nanoparticles : Pb-FREE SOLDERS AND MATERIALS FOR EMERGING INTERCONNECT AND PACKAGING TECHNOLOGIES

Saved in:

Bibliographic Details
Published in:	Journal of electronic materials Vol. 43; no. 12; pp. 4413 - 4420
Main Authors:	ISHIZAKI, Toshitaka, WATANABE, Ryota
Format:	Journal Article
Language:	English
Published:	Heidelberg Springer 2014
Subjects:	Applied sciences Brazing. Soldering Condensed matter: structure, mechanical and thermal properties Cross-disciplinary physics: materials science; rheology Diffusion in solids Electronics Exact sciences and technology Joining, thermal cutting: metallurgical aspects Materials science Metals. Metallurgy Nanoscale materials and structures: fabrication and characterization Optoelectronic devices Other topics in nanoscale materials and structures Physics Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Transport properties of condensed matter (nonelectronic) Electrical conductivity Nanoparticle Intermetallic compound Shear strength High temperature Light emitting diode Solder Cu-Sn intermetallic compound Pb-free Sintering Cu nanoparticle bonding Soldered joint Thermal conductivity Sn nanoparticle Void Diffusion Nanostructured materials Melting point
Online Access:	Get full text
Tags:	Add Tag No Tags, Be the first to tag this record!

Description
ISSN:	0361-5235 1543-186X