Highresolution integration of passives using microcontact printing CP

• Published in: Microelectronics international Vol. 20; no. 1; pp. 52 - 55
• Main Authors: Lakeman, Charles D.E., Fleig, Patrick F.
• Format: Journal Article
• Language: English
• Published: MCB UP Ltd 01-04-2003
• Subjects: Electrical circuits; Printed circuit boards
• ISSN: 1356-5362
• DOI: 10.1108/13565360310455544

As the number of passive components in electronic circuits increases, new methods for fabricating passives are under development to optimize utilization of board space. In this paper, we will describe the performance capabilities of TPL's microcontact printing CP process to fabricate nearnetshape structures with feature sizes ranging from 100 microns to the submicron scale. Like thick film processes, this novel process is compatible with a broad materials base, making a large range of materials properties available. Unlike thick film, however, this novel process employs powderfree inks that can be patterned with high resolution. It is anticipated that this process will enable integration of passive components that show thin film performance at thick film cost. Emphasis in this paper will be placed on processing conditions, and materials properties to demonstrate the feasibility of this process for passive device fabrication.