Design automation of power integrated circuits in EDGE environment

• Published in: [1992] Proceedings The European Conference on Design Automation pp. 252 - 256
• Main Authors: Hebrard, L., Jacquemod, G., Boutherin, B., Le Helley, M.
• Format: Conference Proceeding
• Language: English
• Published: IEEE Comput. Soc. Press 1992
• Subjects: Circuit simulation; Coupling circuits; Design automation; Electric variables; Electrothermal effects; Graphics; Packaging; Power integrated circuits; Predictive models; Software systems
• ISBN: 0818626453; 9780818626456
• DOI: 10.1109/EDAC.1992.205933

Presents SETIPIC, a software package to forecast the electrothermal interactions in the first design steps of power integrated circuits. To give a well-consistent interface with graphic tools to the designer, SETIPIC works under the EDGE CAD system. The software aspect of this integration into EDGE is explained. PICMOST, the thermal simulator used by SETIPIC to obtain the thermal distribution on the layout surface in a transient or stationary mode is also described. In particular, the method to take into account the chip environment (package...) with an automatic mesh to handle aleatory layout configurations is explained. Finally, some thermal simulation results are given.< >