MFIT: Multi-Fidelity Thermal Modeling for 2.5D and 3D Multi-Chiplet Architectures

• Main Authors: Pfromm, Lukas, Kanani, Alish, Sharma, Harsh, Solanki, Parth, Tervo, Eric, Park, Jaehyun, Doppa, Janardhan Rao, Pande, Partha Pratim, Ogras, Umit Y
• Format: Journal Article
• Language: English
• Published: 11-10-2024
• Subjects: Computer Science - Hardware Architecture
• DOI: 10.48550/arxiv.2410.09188

Rapidly evolving artificial intelligence and machine learning applications
require ever-increasing computational capabilities, while monolithic 2D design
technologies approach their limits. Heterogeneous integration of smaller
chiplets using a 2.5D silicon interposer and 3D packaging has emerged as a
promising paradigm to address this limit and meet performance demands. These
approaches offer a significant cost reduction and higher manufacturing yield
than monolithic 2D integrated circuits. However, the compact arrangement and
high compute density exacerbate the thermal management challenges, potentially
compromising performance. Addressing these thermal modeling challenges is
critical, especially as system sizes grow and different design stages require
varying levels of accuracy and speed. Since no single thermal modeling
technique meets all these needs, this paper introduces MFIT, a range of
multi-fidelity thermal models that effectively balance accuracy and speed.
These multi-fidelity models can enable efficient design space exploration and
runtime thermal management. Our extensive testing on systems with 16, 36, and
64 2.5D integrated chiplets and 16x3 3D integrated chiplets demonstrates that
these models can reduce execution times from days to mere seconds and
milliseconds with negligible loss in accuracy.