Performance implications of inductive effects for carbon-nanotube bundle interconnect

• Published in: IEEE electron device letters Vol. 28; no. 4; pp. 305 - 307
• Main Authors: NIEUWOUDT, Arthur, MASSOUD, Yehia
• Format: Journal Article
• Language: English
• Published: New York, NY Institute of Electrical and Electronics Engineers 01-04-2007; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Applied sciences; Bundling; Delay; Design. Technologies. Operation analysis. Testing; Electric potential; Electronics; Exact sciences and technology; Inductance; Integrated circuits; Interconnections; Mathematical models; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Single wall carbon nanotubes; Voltage; Performance evaluation; VLSI circuit; Scalability; Carbon nanotubes; interconnect; Carbon nanotube; Inductance; Nanotube bundle; Singlewalled nanotube; Interconnection; Integrated circuit; Equivalent circuit; magnetic inductance; Delay time; kinetic inductance
• ISSN: 0741-3106; 1558-0563
• DOI: 10.1109/LED.2007.893273

In this letter, we investigate the impact of inductance on bundles of single-walled carbon nanotubes (SWCNT) for future very large scale integration interconnect applications. Leveraging a scalable equivalent circuit model, we assess the relative impact of magnetic inductance and the worst case theoretical value of kinetic inductance on both delay and voltage overshoot. Based on our results, even if the worst case theoretical value for kinetic inductance is assumed, it will only increase the delay and the voltage overshoot by a maximum of 6% and 3%, respectively. Therefore, kinetic inductance will not be a significant factor in the future SWCNT bundle-based interconnect solutions