Pattern transfer by direct photo etching of poly(vinylidene fluoride) using X rays

A direct pattern transfer method has been developed by photo etching poly(vinylidene fluoride) (PVDF) using X rays (1-16 keV) from a synchrotron storage ring. The ability to pattern thin film of PVDF, a piezoelectric, pyroelectric and ferroelectric polymer, has potential applications in the areas of...

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Published in:Journal of microelectromechanical systems Vol. 8; no. 4; pp. 417 - 422
Main Authors: MANOHARA, H. M, MORIKAWA, E, JAEWU CHOI, SPRUNGER, P. T
Format: Journal Article
Language:English
Published: New York, NY Institute of Electrical and Electronics Engineers 01-12-1999
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Abstract A direct pattern transfer method has been developed by photo etching poly(vinylidene fluoride) (PVDF) using X rays (1-16 keV) from a synchrotron storage ring. The ability to pattern thin film of PVDF, a piezoelectric, pyroelectric and ferroelectric polymer, has potential applications in the areas of MEMS, nonlinear optics, and nonvolatile ferroelectric random access memory technology. Without the use of any reactive chemical gas, a maximum etched depth in excess of 9 mu m is achieved. The etched depth for a given photon energy approaches saturation with respect to exposure time. An in situ mass spectrometry revealed the evolution of hydrogen, fluorine, and hydrogen fluoride species. The etched regions turned dark in color indicating a possible increase in the fraction of carbon atoms. The X-ray transmittance of photo etched PVDF approached that of a pure carbon as the exposure time is increased. Upon etching the root mean-square surface roughness of the etched portion increased by more than a factor of two. The rate of etching increased at elevated sample temperatures.
AbstractList A direct pattern transfer method has been developed by photo etching poly(vinylidene fluoride) (PVDF) using X rays (1-16 keV) from a synchrotron storage ring. The ability to pattern thin film of PVDF, a piezoelectric, pyroelectric and ferroelectric polymer, has potential applications in the areas of MEMS, nonlinear optics, and nonvolatile ferroelectric random access memory technology. Without the use of any reactive chemical gas, a maximum etched depth in excess of 9 mu m is achieved. The etched depth for a given photon energy approaches saturation with respect to exposure time. An in situ mass spectrometry revealed the evolution of hydrogen, fluorine, and hydrogen fluoride species. The etched regions turned dark in color indicating a possible increase in the fraction of carbon atoms. The X-ray transmittance of photo etched PVDF approached that of a pure carbon as the exposure time is increased. Upon etching the root mean-square surface roughness of the etched portion increased by more than a factor of two. The rate of etching increased at elevated sample temperatures.
Author MANOHARA, H. M
MORIKAWA, E
JAEWU CHOI
SPRUNGER, P. T
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  givenname: P. T
  surname: SPRUNGER
  fullname: SPRUNGER, P. T
  organization: J. Bennet Johnston, Sr. Center for Advance Microstructures and Devices, Louisiana State University, Baton Rouge, LA 20806, United States
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Issue 4
Keywords Scanning electron microscopy
Pyroelectric properties
Storage ring
Lithography
Photoetching
Piezoelectric properties
X ray
Ferroelectric properties
Thin film
Random access memory(RAM)
Non volatile memory
Synchrotrons
Silicon
Exposure time
Pattern(Microelectronics)
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Snippet A direct pattern transfer method has been developed by photo etching poly(vinylidene fluoride) (PVDF) using X rays (1-16 keV) from a synchrotron storage ring....
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StartPage 417
SubjectTerms Applied sciences
Electronics
Etching
Exact sciences and technology
Fluorine containing polymers
Microelectromechanical devices
Microelectronic fabrication (materials and surfaces technology)
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Surface roughness
Vinyl resins
X rays
Title Pattern transfer by direct photo etching of poly(vinylidene fluoride) using X rays
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Volume 8
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