Accurate Modelling of MHMIC Passive Elements Yields a Successful Design and Packaging of a 20 GHz to 5 GHZ MHMIC Low-Noise Downconverter

• Published in: 40th ARFTG Conference Digest Vol. 22; pp. 41 - 49
• Main Authors: Fikart, J.L., Fairbum, M., Minkus, E., Kwan, Francis
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01-12-1992
• Subjects: Bonding; Circuit noise; Circuit testing; Dielectric thin films; Gallium arsenide; Microwave integrated circuits; MMICs; Packaging; Thin film circuits; Thin film inductors
• DOI: 10.1109/ARFTG.1992.326998

The MHMIC circuits described in this paper have been designed as part of a general technology development program, with some of them subsequently refined for specific applications. One example of this was a downconverter for portable transceivers operating at 20 GHz. The intended outdoor application imposed size restrictions and required that the units operate over a large temperature range. High reliability was also required. Furthermore, low noise and high gain with a very flat frequency response were dictated by overall system considerations. The focus of this paper is not the converter subsystem as such but rather the rationale behind the selection of a circuit technology suitable for applications like this and the corresponding design, modelling, packaging and, in particular, characterization and testing using techniques adaptable to automation.