Integration of electronic components in the thermoplastic processing chain: possibilities through additive manufacturing using conductive materials

An alternative approach for the production of Molded Interconnect Devices (MID), using additive manufacturing of thermoplastics, is presented. Two-component 3D printing enables the processing of a pristine polymer together with a second phase composed out of conductive nanocomposite. For the validat...

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Bibliographic Details

Published in:	2018 13th International Congress Molded Interconnect Devices (MID) pp. 1 - 4
Main Authors:	Morais, Manuel V. C., Reidel, Robin, Weiss, Patrick, Baumann, Sascha, Hubner, Christof, Henning, Frank
Format:	Conference Proceeding
Language:	English
Published:	IEEE 01-09-2018
Subjects:	3d printing additive manufacturing capacitive sensor Capacitive sensors Carbon nanotubes Chemical technology Molded Interconnect Device Nanocomposites Polymers Tactile sensors Three-dimensional printing
Online Access:	Get full text
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