Experiment on evaporation heat transfer performance of porous surface

• Published in: 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) pp. 1 - 5
• Main Authors: Hirasawa, Shigeki, Nakajima, Takuya, Urimoto, Tetsuya, Tsujimoto, Yuya, Takeuchi, Yusuke, Kawanami, Tsuyoshi, Shirai, Katsuaki
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01-05-2016
• Subjects: cooling electronic devices; cross-grooved surface; dry portion; evaporation; Heat transfer; heat transfer coefficient; Liquids; pool boiling; porous surface; Space heating; Temperature measurement; thin glass-beads layer; Water heating
• DOI: 10.1109/ITHERM.2016.7517520
• EISSN: 2577-0799
• ISSN: 1087-9870

Enhancement of evaporation heat transfer performance is important for cooling of electronic devices. Evaporation heat transfer coefficient of two types of porous surfaces supplied with water liquid film was studied experimentally. First porous surface was multi layers of meshed plates with micro-channel of 0.3 mm width. Thin water liquid film was supplied to the porous surface by bubbles. Evaporation heat transfer coefficient of the porous surface with one or two layers of meshed plates was 8×104 W/m 2 K and it was higher than pool boiling heat transfer coefficient. Second porous surface was 1 mm thickness of glass-beads of 0.4 mm in diameter on a heated cupper plate. Water was supplied to the porous layer at the center of the plate. Evaporation heat transfer coefficient was 1000 W/m 2 K after water was supplied. Evaporation heat transfer coefficient increased to 7000 W/m 2 K before appearance of dry portion on the plate, because water film thickness in the porous layer was thin.