Addressing sub-micron thermal warpage: Industrial application on semiconductor devices

Process stress-induced warpage is a known influencing factor on the electrical and optical behavior of microelectronic devices. Warpage can cause catastrophic failures at the wafer front-end and package assembly level where the various processes (chip thinning, glue attach, interconnection) play a m...

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Bibliographic Details

Published in:	2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) pp. 169 - 174
Main Authors:	Safia, Benkoula, Pierre, Vernhes, Nicolas, Choisel, Regis, Braisaz, Rodolfo, Cruz, Stephanie, Rey, Fabien, Quercia
Format:	Conference Proceeding
Language:	English
Published:	IEEE 01-05-2023
Subjects:	assembly die attach optical attach Image resolution integration Optical device fabrication Optical imaging Optical interferometry Optical variables measurement Reflectivity reflow Surface emitting lasers warpage
Online Access:	Get full text
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