Pure Co films of low resistivity and high conformality by low temperature thermal CVD/ALD using novel Co precursors

A new family of highly volatile alkylsilyl-functionality Co precursors, R 3 SiCo(CO) 4 , has been synthesized. One of them, Et 3 SiCo(CO) 4 , has been evaluated by low temperature thermal chemical vapor deposition (CVD) and atomic layer deposition (ALD), which gave low resistive (29 μΩ·cm) pure Co f...

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Bibliographic Details
Published in:	2017 IEEE International Interconnect Technology Conference (IITC) pp. 1 - 3
Main Authors:	Rochat, Raphael, Oschchepkov, Ivan, Changhee Ko
Format:	Conference Proceeding
Language:	English
Published:	IEEE 01-05-2017
Subjects:	Annealing Conductivity Inductors Metals Stability analysis Thermal stability
Online Access:	Get full text
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