All lead free IGBT module with excellent reliability

The subject of lead free solder application of IGBT module is reliability of solder under the insulated substrate in temperature cycling test. This paper presents all lead free IGBT modules with excellent reliability. This was achieved by optimizing of the thermal expansion coefficient of insulated...

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Bibliographic Details

Published in:	Proceedings. ISPSD '05. The 17th International Symposium on Power Semiconductor Devices and ICs, 2005 pp. 79 - 82
Main Authors:	Nishimura, Y., Oonishi, K., Morozumi, A., Mochizuki, E., Takahashi, Y.
Format:	Conference Proceeding
Language:	English
Published:	IEEE 2005
Subjects:	Ceramics Copper Environmentally friendly manufacturing techniques Insulated gate bipolar transistors Insulation Lead Soldering Temperature Thermal conductivity Thermal expansion
Online Access:	Get full text
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