Dual-mode electrical-optical flip-chip I/O interconnects and a compatible probe substrate for wafer-level testing

• Published in: 56th Electronic Components and Technology Conference 2006 p. 8 pp.
• Main Authors: Bakir, M.S., Dang, B., Thacker, H.D., Ogunsola, O.O., Ogra, R., Meindl, J.D.
• Format: Conference Proceeding
• Language: English
• Published: IEEE 2006
• Subjects: Assembly; Bandwidth; Costs; Optical interconnections; Optical polymers; Pins; Probes; Substrates; System-on-a-chip; Testing
• ISBN: 1424401526; 9781424401529
• ISSN: 0569-5503; 2377-5726
• DOI: 10.1109/ECTC.2006.1645744

We describe low cost compatible electrical and optical flip-chip I/O interconnects to leverage the performance requirements of future high-performance chips. Metal-clad polymer pins are fabricated and assembled to demonstrate chip-to-substrate electrical and optical interconnection. In order to address the complexity of wafer-level testing, a probe substrate designed to interface with the metal-clad polymer pin I/O interconnects is fabricated and demonstrated. The demonstration of these two distinct, yet highly related, advances (novel I/O and compatible probe substrate) addresses some of the key daunting problems facing the semiconductor industry