The application of flip chip bonding technology using anisotropic conductive film to the mobile communications terminals

In the field of mobile communications systems, the terminals have been downsized and given higher functions very rapidly. High-density surface mount technology is therefore required. For this reason, flip chip bonding (FCB) technology, which is the ultimate high-density surface mount technology at p...

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Bibliographic Details

Published in:	2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225) pp. 94 - 99
Main Authors:	Torii, A., Takizawa, M., Sawano, M.
Format:	Conference Proceeding
Language:	English
Published:	IEEE 1998
Subjects:	Anisotropic conductive films Anisotropic magnetoresistance Bonding Conducting materials Flip chip Gold Materials reliability Mobile communication Reflow soldering Surface-mount technology
Online Access:	Get full text
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