Device simulation for smart integrated systems (DESSIS)

• Published in: Proceedings of Third International Conference on Electronics, Circuits, and Systems Vol. 2; pp. 752 - 755 vol.2
• Main Authors: Baccarani, G., Rudan, M., Lorenzini, M., Fichtner, W., Litsios, J., Schenk, A., van Staa, P., Kaeser, L., Kampmann, A., Marmiroli, A., Sala, C., Ravanelli, E.
• Format: Conference Proceeding
• Language: English
• Published: IEEE 1996
• Subjects: Circuit simulation; Context modeling; EPROM; Flexible printed circuits; Mesh generation; Microelectronics; Nonvolatile memory; Numerical models; Power system modeling; Tunneling
• ISBN: 9780780336506; 078033650X
• DOI: 10.1109/ICECS.1996.584471

In this paper we present the most important achievements of the ESPRIT 6075 (DESSIS) Project, which was carried out in the period 1992-1995 with the participation of SGS-Thomson Microelectronics, Robert Bosch GmbH, the Swiss Federal Institute of Technology and the University of Bologna. Within the framework of this project, a new mixed-mode circuit/device simulator called DESSIS has been developed, which overcomes most limitations of existing simulators by allowing for unprecedented flexibility in structure definition, mesh generation, physical models and numerical efficiency. Three application examples are illustrated to prove the enormous potential of the above simulation code for process, device and circuit designers.