Bond Reliability Improvement at High Temperature by Pd Addition on Au Bonding Wires

To extend the qualification domain to the biggest package size in the automotive environment at high temperature, it is necessary to improve the Au-Al bond reliability. Thus, the improvement provided by addition of palladium as alloying elements to Au bonding wires is evaluated. In this study, the u...

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Bibliographic Details

Published in:	2008 10th Electronics Packaging Technology Conference pp. 800 - 807
Main Authors:	Bahi, M.A., Lecuyer, P., Gentil, A., Fremont, H., Landesman, J.-P., Christien, F.
Format:	Conference Proceeding
Language:	English
Published:	IEEE 01-01-2008
Subjects:	Aging Alloying Automotive engineering Bonding Gold Packaging Palladium Qualifications Temperature Wires
Online Access:	Get full text
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